Authors: Leith, SD Schwartz, DT

Citation: Sd. Leith et Dt. Schwartz, High-rate through-mold electrodeposition of thick (> 200 mu m) NiFe MEMS components with uniform composition, J MICROEL S, 8(4), 1999, pp. 384-392

Authors: Leith, SD Schwartz, DT

Citation: Sd. Leith et Dt. Schwartz, In-situ fabrication of sacrificial layers in electrodeposited NiFe microstructures, J MICROM M, 9(1), 1999, pp. 97-104

Authors: Leith, SD Schwartz, DT

Citation: Sd. Leith et Dt. Schwartz, Through-mold electrodeposition using the uniform injection cell (UIC): Workpiece and pattern scale uniformity, ELECTR ACT, 44(23), 1999, pp. 4017-4027

Authors: Leith, SD Ramli, S Schwartz, DT

Citation: Sd. Leith et al., Characterization of NixFe1-x(0.10 < x < 0.95) electrodeposition from a family of sulfamate-chloride electrolytes, J ELCHEM SO, 146(4), 1999, pp. 1431-1435