Authors: Hay, JC Liniger, EG Liu, XH

Citation: Jc. Hay et al., Evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications, J MATER RES, 16(2), 2001, pp. 385-393

Authors: Wang, PC Noyan, IC Kaldor, SK Jordan-Sweet, JL Liniger, EG Hu, CK

Citation: Pc. Wang et al., Real-time x-ray microbeam characterization of electromigration effects in Al(Cu) wires, APPL PHYS L, 78(18), 2001, pp. 2712-2714

Authors: Noyan, IC Wang, PC Kaldor, SK Jordan-Sweet, JL Liniger, EG

Citation: Ic. Noyan et al., Divergence effects in monochromatic x-ray microdiffraction using tapered capillary optics, REV SCI INS, 71(5), 2000, pp. 1991-2000

Authors: Wang, PC Noyan, IC Kaldor, SK Jordan-Sweet, JL Liniger, EG Hu, CK

Citation: Pc. Wang et al., Topographic measurement of electromigration-induced stress gradients in aluminum conductor lines, APPL PHYS L, 76(25), 2000, pp. 3726-3728

Authors: Cook, RF Liniger, EG

Citation: Rf. Cook et Eg. Liniger, Stress-corrosion cracking of low-dielectric-constant spin-on-glass thin films, J ELCHEM SO, 146(12), 1999, pp. 4439-4448