Authors:
Chang, TC
Liu, PT
Tsai, TM
Yeh, FS
Tseng, TY
Tsai, MS
Chen, BC
Yang, YL
Sze, SM
Citation: Tc. Chang et al., Elimination of dielectric degradation for chemical-mechanical planarization of low-k hydrogen silisesquioxane, JPN J A P 1, 40(5A), 2001, pp. 3143-3146
Citation: Pt. Liu et al., Inhibition of nitric oxide synthesis by L-name exacerbates acute lung injury induced by hepatic ischemia-reperfusion, SHOCK, 16(3), 2001, pp. 211-217
Authors:
Liu, PT
Chang, TC
Huang, MC
Tsai, MS
Sze, SM
Citation: Pt. Liu et al., Highly reliable chemical-mechanical polishing process for organic low-k methylsilsesquioxane, J VAC SCI B, 19(4), 2001, pp. 1212-1218
Citation: Pt. Liu, Extremely small sample size in some toxicity studies: An example from the rabbit eye irritation test, REGUL TOX P, 33(2), 2001, pp. 187-191
Citation: Tc. Chang et al., Enhancement of barrier properties in chemical vapor deposited TiN employing multi-stacked Ti/TiN structure, JPN J A P 2, 39(2A), 2000, pp. L82-L85
Citation: Pt. Liu et al., Role of endogenous nitric oxide in TNF-alpha and IL-1 beta generation in hepatic ischemia-reperfusion, SHOCK, 13(3), 2000, pp. 217-223
Citation: Pt. Liu et al., Effects of NH3-plasma nitridation on the electrical characterizations of low-k hydrogen silsesquioxane with copper interconnects, IEEE DEVICE, 47(9), 2000, pp. 1733-1739
Authors:
Liu, PT
Chang, TC
Yang, YL
Cheng, YF
Lee, JK
Shih, FY
Tsai, E
Chen, G
Sze, SM
Citation: Pt. Liu et al., Improvement on intrinsic electrical properties of low-k hydrogen silsesquioxane/copper interconnects employing deuterium plasma treatment, J ELCHEM SO, 147(3), 2000, pp. 1186-1192
Authors:
Liu, PT
Chang, TC
Huang, MC
Yang, YL
Mor, YS
Tsai, MS
Chung, H
Hou, J
Sze, SM
Citation: Pt. Liu et al., Improvement of post-chemical mechanical planarization characteristics on organic low k methylsilsesquioxane as intermetal dielectric, J ELCHEM SO, 147(11), 2000, pp. 4313-4317
Citation: Pt. Liu et al., Reliability of multistacked chemical vapor deposited Ti/TiN structure as the diffusion barrier in ultralarge scale integrated metallization, J ELCHEM SO, 147(1), 2000, pp. 368-372
Citation: Pt. Liu et al., Enhancing the oxygen plasma resistance of low-k methylsilsesquioxane by H-2 plasma treatment, JPN J A P 1, 38(6A), 1999, pp. 3482-3486
Authors:
Liu, PT
Chang, TC
Yang, YL
Cheng, YF
Shih, FY
Lee, JK
Tsai, E
Sze, SM
Citation: Pt. Liu et al., Effectively blocking copper diffusion at low-k hydrogen silsesquioxane/copper interface, JPN J A P 1, 38(11), 1999, pp. 6247-6252
Citation: Tc. Chang et al., Effects of hydrogen on electrical and chemical properties of low-k hydrogen silsesquioxane as an intermetal dielectric for nonetchback processes, EL SOLID ST, 2(8), 1999, pp. 390-392
Authors:
Page, K
Li, D
Hodge, JA
Liu, PT
Vanden Hoek, TL
Becker, LB
Pestell, RG
Rosner, MR
Hershenson, MB
Citation: K. Page et al., Characterization of a rac1 signaling pathway to cyclin D-1 expression in airway smooth muscle cells, J BIOL CHEM, 274(31), 1999, pp. 22065-22071
Authors:
Chang, TC
Liu, PT
Mor, YS
Sze, SM
Yang, YL
Feng, MS
Pan, FM
Dai, BT
Chang, CY
Citation: Tc. Chang et al., The novel improvement of low dielectric constant methylsilsesquioxane by N2O plasma treatment, J ELCHEM SO, 146(10), 1999, pp. 3802-3806
Authors:
Liu, PT
Xu, BH
Hock, CE
Nagele, R
Sun, FF
Wong, PYK
Citation: Pt. Liu et al., NO modulates P-selectin and ICAM-1 mRNA expression and hemodynamic alterations in hepatic I/R, AM J P-HEAR, 44(6), 1998, pp. H2191-H2198