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Results:
1-18
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Results: 18
Authors:
Choi, S
Lee, JG
Guo, F
Bieler, TR
Subramanian, KN
Lucas, JP
Citation: S. Choi et al., Creep properties of Sn-Ag solder joints containing intermetallic particles, JOM-J MIN, 53(6), 2001, pp. 22-26
Authors:
Guo, F
Lucas, JP
Subramanian, KN
Citation: F. Guo et al., Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints, J MAT S-M E, 12(1), 2001, pp. 27-35
Authors:
Choi, S
Bieler, TR
Subramanian, KN
Lucas, JP
Citation: S. Choi et al., Effects of Pb contamination on the eutectic Sn-Ag solder joint, SOLDER S MT, 13(2), 2001, pp. 26-29
Authors:
Guo, F
Choi, S
Lucas, JP
Subramanian, KN
Citation: F. Guo et al., Microstructural characterisation of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5Ag composite solders, SOLDER S MT, 13(1), 2001, pp. 7-18
Authors:
Guo, F
Lee, J
Choi, S
Lucas, JP
Bieler, TR
Subramanian, KN
Citation: F. Guo et al., Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles, J ELEC MAT, 30(9), 2001, pp. 1073-1082
Authors:
Jadhav, SG
Bieler, TR
Subramanian, KN
Lucas, JP
Citation: Sg. Jadhav et al., Stress relaxation behavior of composite and eutectic Sn-Ag solder joints, J ELEC MAT, 30(9), 2001, pp. 1197-1205
Authors:
Guo, F
Lee, J
Lucas, JP
Subramanian, KN
Bieler, TR
Citation: F. Guo et al., Creep properties of eutectic Sn-3.5Ag solder joints reinforced with mechanically incorporated Ni particles, J ELEC MAT, 30(9), 2001, pp. 1222-1227
Authors:
Choi, S
Lucas, JP
Subramanian, KN
Bieler, TR
Citation: S. Choi et al., Formation and growth of interfacial intermetallic layers in eutectic Sn-Agsolder and its composite solder joints, J MAT S-M E, 11(6), 2000, pp. 497-502
Authors:
McDougall, J
Choi, S
Bieler, TR
Subramanian, KN
Lucas, JP
Citation: J. Mcdougall et al., Quantification of creep strain distribution in small crept lead-free in-situ composite and non composite solder joints, MAT SCI E A, 285(1-2), 2000, pp. 25-34
Authors:
Sigelko, J
Choi, S
Subramanian, KN
Lucas, JP
Citation: J. Sigelko et al., The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints, J ELEC MAT, 29(11), 2000, pp. 1307-1311
Authors:
Guo, F
Choi, S
Lucas, JP
Subramanian, KN
Citation: F. Guo et al., Effects of reflow on wettability, microstructure and mechanical propertiesin lead-free solders, J ELEC MAT, 29(10), 2000, pp. 1241-1248
Authors:
Choi, S
Subramanian, KN
Lucas, JP
Bieler, TR
Citation: S. Choi et al., Thermomechanical fatigue behavior of Sn-Ag solder joints, J ELEC MAT, 29(10), 2000, pp. 1249-1257
Authors:
Subramanian, KN
Bieler, TR
Lucas, JP
Citation: Kn. Subramanian et al., Microstructural engineering of solders, J ELEC MAT, 28(11), 1999, pp. 1176-1183
Authors:
Sigelko, J
Choi, S
Subramanian, KN
Lucas, JP
Bieler, TR
Citation: J. Sigelko et al., Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5reinforcements, J ELEC MAT, 28(11), 1999, pp. 1184-1188
Authors:
Choi, S
Bieler, TR
Lucas, JP
Subramanian, KN
Citation: S. Choi et al., Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging, J ELEC MAT, 28(11), 1999, pp. 1209-1215
Authors:
Lucas, JP
Guo, F
McDougall, J
Bieler, TR
Subramanian, KN
Park, JK
Citation: Jp. Lucas et al., Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique, J ELEC MAT, 28(11), 1999, pp. 1270-1275
Authors:
Zhou, JM
Lucas, JP
Citation: Jm. Zhou et Jp. Lucas, Hygrothermal effects of epoxy resin. Part I: the nature of water in epoxy, POLYMER, 40(20), 1999, pp. 5505-5512
Authors:
Zhou, JM
Lucas, JP
Citation: Jm. Zhou et Jp. Lucas, Hygrothermal effects of epoxy resin. Part II: variations of glass transition temperature, POLYMER, 40(20), 1999, pp. 5513-5522
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