Authors: BONDA NR FANG T KASKOUN K LYTLE WH MARLIN B SWAN G STAFFORD JW TAM G

Citation: Nr. Bonda et al., PHYSICAL DESIGN AND ASSEMBLY PROCESS-DEVELOPMENT OF A MULTICHIP PACKAGE CONTAINING A LIGHT-EMITTING DIODE (LED) ARRAY DIE, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 20(4), 1997, pp. 389-395