AAAAAA
Results:
1-8
|
Results: 8
Authors:
MITTAL S
MASADA GY
BERGMAN TL
Citation: S. Mittal et al., MECHANICAL RESPONSE OF PCB ASSEMBLIES DURING INFRARED REFLOW SOLDERING, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(1), 1996, pp. 127-133
Authors:
KIM YGG
PAVULURI JK
WHITE JR
BUSCHVISHNIAC IJ
MASADA GY
Citation: Ygg. Kim et al., THERMOCOMPRESSION BONDING EFFECTS ON BUMP-PAD ADHESION, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(1), 1995, pp. 192-200
Authors:
LEIFER J
MASADA GY
BUSCHVISHNIAC IJ
Citation: J. Leifer et al., FINITE-ELEMENT SIMULATION OF A NONDESTRUCTIVE SHEAR TEST FOR TAB BONDS, IEEE transactions on semiconductor manufacturing, 8(3), 1995, pp. 352-359
Authors:
LEE FS
MOON TJ
MASADA GY
Citation: Fs. Lee et al., EXTENDED BOND GRAPH RETICULATION OF PIEZOELECTRIC CONTINUA, Journal of dynamic systems, measurement, and control, 117(1), 1995, pp. 1-7
Authors:
YEN CM
MASADA GY
Citation: Cm. Yen et Gy. Masada, DYNAMIC ANALYSIS OF FLEXIBLE BODIES USING EXTENDED BOND GRAPHS, Journal of dynamic systems, measurement, and control, 116(1), 1994, pp. 66-72
Authors:
LEE FS
MOON TJ
MASADA GY
Citation: Fs. Lee et al., EXTENDED BOND GRAPH RETICULATION OF MAGNETOSTRICTIVE CONTINUA, Journal of applied physics, 75(9), 1994, pp. 4621-4627
Authors:
LEE FS
MOON TJ
MASADA GY
Citation: Fs. Lee et al., MODELING OF DISTRIBUTED ELECTROMECHANICAL SYSTEMS USING EXTENDED BONDGRAPHS, Journal of the Franklin Institute, 331(1), 1994, pp. 43-60
Authors:
YEN CM
MASADA GY
CHAN WM
Citation: Cm. Yen et al., DYNAMIC ANALYSIS OF A 2-LINK FLEXIBLE MANIPULATOR SYSTEM USING EXTENDED BOND GRAPHS, Journal of the Franklin Institute, 330(6), 1993, pp. 1113-1134
Risultati:
1-8
|