Authors: MAVOORI H JIN S

Citation: H. Mavoori et S. Jin, LOW THERMAL-EXPANSION COPPER COMPOSITES VIA NEGATIVE CTE METALLIC ELEMENTS, JOM, 50(6), 1998, pp. 70-72

Authors: JIN S MAVOORI H

Citation: S. Jin et H. Mavoori, PROCESSING AND PROPERTIES OF CVD DIAMOND FOR THERMAL MANAGEMENT, Journal of electronic materials, 27(11), 1998, pp. 1148-1153

Authors: MAVOORI H JIN S

Citation: H. Mavoori et S. Jin, NEW, CREEP-RESISTANT, LOW-MELTING POINT SOLDERS WITH ULTRAFINE OXIDE DISPERSIONS, Journal of electronic materials, 27(11), 1998, pp. 1216-1222

Authors: JIN S ESPINDOLA RP MAVOORI H STRASSER TH DEMARCO JJ

Citation: S. Jin et al., MAGNETICALLY PROGRAMMABLE FIBER BRAGG GRATINGS, Electronics Letters, 34(22), 1998, pp. 2158-2159

Authors: MAVOORI H JIN S

Citation: H. Mavoori et S. Jin, SIGNIFICANTLY ENHANCED CREEP RESISTANCE IN LOW-MELTING-POINT SOLDERS THROUGH NANOSCALE OXIDE DISPERSIONS, Applied physics letters, 73(16), 1998, pp. 2290-2292

Authors: MAVOORI H CHIN J VAYNMAN S MORAN B KEER L FINE M

Citation: H. Mavoori et al., CREEP, STRESS-RELAXATION, AND PLASTIC-DEFORMATION IN SN-AG AND SN-ZN EUTECTIC SOLDERS, Journal of electronic materials, 26(7), 1997, pp. 783-790