Authors: MERMET JL MOUCHE MJ PIRES F RICHARD E TORRES J PALLEAU J BRAUD F

Citation: Jl. Mermet et al., CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN, Journal de physique. IV, 5(C5), 1995, pp. 517-523

Authors: MERMET JL MOUCHE MJ PIRES F RICHARD E TORRES J PALLEAU J BRAUD F

Citation: Jl. Mermet et al., CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN, Journal de physique. IV, 5(C5), 1995, pp. 517-523

Authors: MOUCHE MJ MERMET JL PIRES F RICHARD E TORRES J PALLEAU J BRAUD F

Citation: Mj. Mouche et al., PROCESS OPTIMIZATION OF COPPER MOCVD USING MODELING EXPERIMENTAL-DESIGN, Applied surface science, 91(1-4), 1995, pp. 129-133

Authors: BRAUD F TORRES J PALLEAU J MERMET JL MOUCHE MJ

Citation: F. Braud et al., TI-DIFFUSION BARRIER IN CU-BASED METALLIZATION, Applied surface science, 91(1-4), 1995, pp. 251-256

Authors: MOUCHE MJ MERMET JL ROMAND M CHARBONNIER M

Citation: Mj. Mouche et al., METAL-ORGANIC CHEMICAL-VAPOR-DEPOSITION OF COPPER USING HYDRATED COPPER FORMATE AS A NEW PRECURSOR, Thin solid films, 262(1-2), 1995, pp. 1-6