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Results:
1-8
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Results: 8
Authors:
Faust, N
Messler, RW
Khatri, S
Citation: N. Faust et al., Alternatives for joining Si wafers to strain-accommodating Cu for high-power electronics, J ELEC MAT, 30(10), 2001, pp. 1276-1286
Authors:
Genc, S
Messler, RW
Citation: S. Genc et Rw. Messler, A method for attachment design concept development in integral snap-fit assemblies, J MEC DESIG, 122(3), 2000, pp. 257-264
Authors:
Palmer, MA
Redmond, PE
Messler, RW
Citation: Ma. Palmer et al., Thermomechanical fatigue testing and analysis of solder alloys, J ELEC PACK, 122(1), 2000, pp. 48-54
Authors:
Li, L
Messler, RW
Citation: L. Li et Rw. Messler, Stress relaxation study of HAZ reheat cracking in type 347 stainless steel, WELDING J, 79(6), 2000, pp. 137S-144S
Authors:
Mitlin, D
Raeder, CH
Messler, RW
Citation: D. Mitlin et al., Solid solution creep behavior of Sn-xBi alloys, MET MAT T A, 30(1), 1999, pp. 115-122
Authors:
Raeder, CH
Messler, RW
Coffin, LF
Citation: Ch. Raeder et al., Partially-constrained thermomechanical fatigue of eutectic tin-bismuth/copper solder joints, J ELEC MAT, 28(9), 1999, pp. 1045-1054
Authors:
Li, L
Messler, RW
Citation: L. Li et Rw. Messler, The effects of phosphorus and sulfur on susceptibility to weld hot cracking in austenitic stainless steels, WELDING J, 78(12), 1999, pp. 387S-396S
Authors:
Raeder, CH
Mitlin, D
Messler, RW
Citation: Ch. Raeder et al., Modelling the creep rates of eutectic Bi-Sn solder using the data from itsconstitutive phases, J MATER SCI, 33(18), 1998, pp. 4503-4508
Risultati:
1-8
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