Authors:
Aspar, B
Jalaguier, E
Mas, A
Locatelli, C
Rayssac, O
Moriceau, H
Pocas, S
Papon, AM
Michaud, JF
Bruel, M
Citation: B. Aspar et al., Smart-Cut (R) process using metallic bonding: Application to transfer of Si, GaAs, InP thin films, ELECTR LETT, 35(12), 1999, pp. 1024-1025