Authors: Liu, PT Chang, TC Su, H Mor, YS Yang, YL Chung, H Hou, J Sze, SM

Citation: Pt. Liu et al., Improvement in integration issues for organic low-k hybrid-organic-siloxane-polymer, J ELCHEM SO, 148(2), 2001, pp. F30-F34

Authors: Liu, PT Chang, TC Huang, MC Yang, YL Mor, YS Tsai, MS Chung, H Hou, J Sze, SM

Citation: Pt. Liu et al., Improvement of post-chemical mechanical planarization characteristics on organic low k methylsilsesquioxane as intermetal dielectric, J ELCHEM SO, 147(11), 2000, pp. 4313-4317

Authors: Liu, PT Chang, TC Mor, YS Sze, SM

Citation: Pt. Liu et al., Enhancing the oxygen plasma resistance of low-k methylsilsesquioxane by H-2 plasma treatment, JPN J A P 1, 38(6A), 1999, pp. 3482-3486

Authors: Chang, TC Liu, PT Mei, YJ Mor, YS Perng, TH Yang, YL Sze, SM

Citation: Tc. Chang et al., Effects of H-2 plasma treatment on low dielectric constant methylsilsesquioxane, J VAC SCI B, 17(5), 1999, pp. 2325-2330

Authors: Chang, TC Mor, YS Liu, PT Sze, SM Yang, YL Tsai, MS Chang, CY

Citation: Tc. Chang et al., The novel precleaning treatment for selective tungsten chemical vapor deposition, THIN SOL FI, 356, 1999, pp. 451-455

Authors: Chang, TC Liu, PT Mor, YS Sze, SM Yang, YL Feng, MS Pan, FM Dai, BT Chang, CY

Citation: Tc. Chang et al., The novel improvement of low dielectric constant methylsilsesquioxane by N2O plasma treatment, J ELCHEM SO, 146(10), 1999, pp. 3802-3806