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Results:
1-7
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Results: 7
Authors:
Nakayama, W
Behnia, M
Soodphakdee, D
Citation: W. Nakayama et al., A novel approach to the design of complex heat transfer systems: Portable computer design - A case study, IEEE T COMP, 24(2), 2001, pp. 199-206
Authors:
Ramaswamy, C
Joshi, YK
Nakayama, W
Johnson, WB
Citation: C. Ramaswamy et al., Combined effects of sub-cooling and operating pressure on the performance of a two-chamber thermosyphon, IEEE T COMP, 23(1), 2000, pp. 61-69
Authors:
Nakayama, W
Citation: W. Nakayama, Thermal issues in microsystems packaging, IEEE T AD P, 23(4), 2000, pp. 602-607
Authors:
Nakayama, W
Behnia, M
Mishima, H
Citation: W. Nakayama et al., Impinging jet boiling of a fluorinert liquid on a foil heater array, J ELEC PACK, 122(2), 2000, pp. 132-137
Authors:
Nakayama, W
Behnia, M
Citation: W. Nakayama et M. Behnia, Roles of CFD simulation in thermal analysis of microelectronic equipment, DEV HEAT TR, 2, 1999, pp. 49-75
Authors:
Nakayama, W
Citation: W. Nakayama, Enhanced heat transfer in tight space - A frontier for thermal management of microelectronic equipment, J ENHANC H, 6(2-4), 1999, pp. 121-133
Authors:
Ramaswamy, C
Joshi, Y
Nakayama, W
Johnson, WB
Citation: C. Ramaswamy et al., Thermal performance of a compact two-phase thermosyphon: Response to evaporator confinement and transient loads, J ENHANC H, 6(2-4), 1999, pp. 279-288
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1-7
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