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Results: 1-7 |
Results: 7
NEW-GENERATION SCANNING ELECTRON-MICROSCOPY TECHNOLOGY-BASED ON THE CONCEPT OF ACTIVE IMAGE-PROCESSING
Authors: OHO E HOSHINO Y OGASHIWA T
Citation: E. Oho et al., NEW-GENERATION SCANNING ELECTRON-MICROSCOPY TECHNOLOGY-BASED ON THE CONCEPT OF ACTIVE IMAGE-PROCESSING, Scanning, 19(7), 1997, pp. 483-488
A NATURAL COLOR SCANNING ELECTRON-MICROSCOPY IMAGE
Authors: OHO E OGASHIWA T
Citation: E. Oho et T. Ogashiwa, A NATURAL COLOR SCANNING ELECTRON-MICROSCOPY IMAGE, Scanning, 18(5), 1996, pp. 331-336
PROPER ACQUISITION AND HANDLING OF SCANNING ELECTRON-MICROSCOPY IMAGES USING A HIGH-PERFORMANCE PERSONAL-COMPUTER
Authors: OHO E ICHISE N OGASHIWA T
Citation: E. Oho et al., PROPER ACQUISITION AND HANDLING OF SCANNING ELECTRON-MICROSCOPY IMAGES USING A HIGH-PERFORMANCE PERSONAL-COMPUTER, Scanning, 18(2), 1996, pp. 72-80
FLIP-CHIP BONDING USING SUPERCONDUCTING SOLDER BUMP
Authors: OGASHIWA T NAKAGAWA H AKIMOTO H SHIGYO H TAKADA S
Citation: T. Ogashiwa et al., FLIP-CHIP BONDING USING SUPERCONDUCTING SOLDER BUMP, JPN J A P 1, 34(8A), 1995, pp. 4043-4046
NECESSITY AND UTILITY OF A SCANNING ELECTRON-MICROSCOPE WITH 4,096 LINES
Authors: OHO E ICHISE N OGASHIWA T
Citation: E. Oho et al., NECESSITY AND UTILITY OF A SCANNING ELECTRON-MICROSCOPE WITH 4,096 LINES, Journal of Electron Microscopy, 44(5), 1995, pp. 390-398
CHARACTERISTICS OF RAPID SOLIDIFIED PB-SN ALLOY WIRES AND THEIR APPLICATION TO SOLDER BUMP FOR FINE JUNCTION
Authors: OGASHIWA T INOUE A
Citation: T. Ogashiwa et A. Inoue, CHARACTERISTICS OF RAPID SOLIDIFIED PB-SN ALLOY WIRES AND THEIR APPLICATION TO SOLDER BUMP FOR FINE JUNCTION, Nippon Kinzoku Gakkaishi, 58(8), 1994, pp. 944-951
THERMAL FATIGUE-STRENGTH OF PB-SN-SB-CU S OLDER BUMPS
Authors: OGASHIWA T MURAKAMI Y INOUE A
Citation: T. Ogashiwa et al., THERMAL FATIGUE-STRENGTH OF PB-SN-SB-CU S OLDER BUMPS, Nippon Kinzoku Gakkaishi, 58(8), 1994, pp. 952-958
Risultati: 1-7 |