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Results:
1-8
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Results: 8
Authors:
STAVREVA Z
ZEIDLER D
PLOTNER M
DRESCHER K
Citation: Z. Stavreva et al., CHARACTERISTICS IN CHEMICAL-MECHANICAL POLISHING OF COPPER - COMPARISON OF POLISHING PADS, Applied surface science, 108(1), 1997, pp. 39-44
Authors:
STAVREVA Z
ZEIDLER D
PLOTNER M
DRESCHER K
Citation: Z. Stavreva et al., INFLUENCE OF PROCESS PARAMETERS ON CHEMICAL-MECHANICAL POLISHING OF COPPER, Microelectronic engineering, 37-8(1-4), 1997, pp. 143-149
Authors:
VOGT M
KACHEL M
PLOTNER M
DRESCHER K
Citation: M. Vogt et al., DIELECTRIC BARRIERS FOR CU METALLIZATION SYSTEMS, Microelectronic engineering, 37-8(1-4), 1997, pp. 181-187
Authors:
ZEIDLER D
STAVREVA Z
PLOTNER M
DRESCHER K
Citation: D. Zeidler et al., THE INTERACTION BETWEEN DIFFERENT BARRIER METALS AND THE COPPER SURFACE DURING THE CHEMICAL-MECHANICAL POLISHING, Microelectronic engineering, 37-8(1-4), 1997, pp. 237-243
Authors:
STAVREVA Z
ZEIDLER D
PLOTNER M
GRASSHOFF G
DRESCHER K
Citation: Z. Stavreva et al., CHEMICAL-MECHANICAL POLISHING OF COPPER FOR INTERCONNECT FORMATION, Microelectronic engineering, 33(1-4), 1997, pp. 249-257
Authors:
ZEIDLER D
STAVREVA Z
PLOTNER M
DRESCHER K
Citation: D. Zeidler et al., CHARACTERIZATION OF CU CHEMICAL-MECHANICAL POLISHING BY ELECTROCHEMICAL INVESTIGATIONS, Microelectronic engineering, 33(1-4), 1997, pp. 259-265
Authors:
TORRES J
MERMET JL
MADAR R
CREAN G
GESSNER T
BERTZ A
HASSE W
PLOTNER M
BINDER F
SAVE D
Citation: J. Torres et al., COPPER-BASED METALLIZATION FOR ULSI CIRCUITS, Microelectronic engineering, 34(1), 1996, pp. 119-122
Authors:
STAVREVA Z
ZEIDLER D
PLOTNER M
DRESCHER K
Citation: Z. Stavreva et al., CHEMICAL-MECHANICAL POLISHING OF COPPER FOR MULTILEVEL METALLIZATION, Applied surface science, 91(1-4), 1995, pp. 192-196
Risultati:
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