COPPER-BASED METALLIZATION FOR ULSI CIRCUITS

The feasibility of copper metallization for interconnections in ultra- large scale integrated circuits is under evaluation in the ESPRIT/JESS I project COIN (Copper INterconnections). Research has been performed comprising all basic aspects of copper metallization for integrated ci rcuits, such as development and evaluation of processes for metal depo sition and patterning, evaluation of materials which could act as barr ier against copper diffusion, electrical testing of the barrier layer performance and finally evaluation of the electromigration performance of copper interconnections.