Authors:
MALEVILLE C
ASPAR B
POUMEYROL T
MORICEAU H
BRUEL M
AUBERTONHERVE AJ
BARGE T
Citation: C. Maleville et al., WAFER BONDING AND H-IMPLANTATION MECHANISMS INVOLVED IN THE SMART-CUT(R) TECHNOLOGY, Materials science & engineering. B, Solid-state materials for advanced technology, 46(1-3), 1997, pp. 14-19