Authors: Pang, JHL Tan, KH Shi, XQ Wang, ZP

Citation: Jhl. Pang et al., Thermal cycling aging effects on microstructural and mechanical propertiesof a single PBGA solder joint specimen, IEEE T COMP, 24(1), 2001, pp. 10-15

Authors: Pang, JHL Seetoh, CW Wang, ZP

Citation: Jhl. Pang et al., CBGA solder joint reliability evaluation based on elastic-plastic-creep analysis, J ELEC PACK, 122(3), 2000, pp. 255-261