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ENG
Results:
1-4
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Results: 4
Fine grinding of silicon wafers
Authors:
Pei, ZJ Strasbaugh, A
Citation:
Zj. Pei et A. Strasbaugh, Fine grinding of silicon wafers, INT J MACH, 41(5), 2001, pp. 659-672
An experimental investigation of rotary ultrasonic face milling
Authors:
Pei, ZJ Ferreira, PM
Citation:
Zj. Pei et Pm. Ferreira, An experimental investigation of rotary ultrasonic face milling, INT J MACH, 39(8), 1999, pp. 1327-1344
Grinding induced subsurface cracks in silicon wafers
Authors:
Pei, ZJ Billingsley, SR Miura, S
Citation:
Zj. Pei et al., Grinding induced subsurface cracks in silicon wafers, INT J MACH, 39(7), 1999, pp. 1103-1116
Rotary ultrasonic machining of ceramics
Authors:
Ferreira, PM Pei, ZJ
Citation:
Pm. Ferreira et Zj. Pei, Rotary ultrasonic machining of ceramics, MANUF EN MA, 53, 1999, pp. 525-549
Risultati:
1-4
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