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Results: 26-35/35
Authors:
Zhao, CH
Pizzi, A
Garnier, S
Citation: Ch. Zhao et al., Fast advancement and hardening acceleration of low-condensation alkaline PF resins by esters and copolymerized urea, J APPL POLY, 74(2), 1999, pp. 359-378
Authors:
Soulard, C
Kamoun, C
Pizzi, A
Citation: C. Soulard et al., Uron and uron-urea-formaldehyde resins, J APPL POLY, 72(2), 1999, pp. 277-289
Authors:
Pizzi, A
Lu, X
Garcia, R
Citation: A. Pizzi et al., Lignocellulosic substrates influence on TTT and CHT curing diagrams of polycondensation resins, J APPL POLY, 71(6), 1999, pp. 915-925
Authors:
Pizzi, A
Citation: A. Pizzi, On the correlation equations of liquid and solid C-13-NMR, thermomechanical analysis, T-g, and network strength in polycondensation resins, J APPL POLY, 71(10), 1999, pp. 1703-1709
Authors:
Pichelin, F
Kamoun, C
Pizzi, A
Citation: F. Pichelin et al., Hexamine hardener behaviour: effects on wood glueing, tannin and other wood adhesives, HOLZ ROH WE, 57(5), 1999, pp. 305-317
Authors:
Cremonini, C
Pizzi, A
Citation: C. Cremonini et A. Pizzi, Field weathering of plywood panels bonded with UF adhesives and low proportions of melamine salts, HOLZ ROH WE, 57(5), 1999, pp. 318-318
Authors:
Pizzi, A
Citation: A. Pizzi, Molecular mechanics-dynamics modeling and adhesion, MATER ENGN, 14, 1999, pp. 83-119
Authors:
Lu, X
Pizzi, A
Citation: X. Lu et A. Pizzi, Curing conditions effects on the characteristics of thermosetting adhesives-bonded wood joints Part 2: Hot postcuring improvement of UF particleboards and its temperature forecasting model, HOLZ ROH WE, 56(6), 1998, pp. 393-401
Authors:
Lu, X
Pizzi, A
Citation: X. Lu et A. Pizzi, Curing conditions effects on the characteristics of thermosetting adhesives-bonded wood joints - Part 1. Substrate influence on TTT and CHT curing diagrams of wood adhesives (vol 56, pg 339, 1998), HOLZ ROH WE, 56(6), 1998, pp. 401-401
Authors:
Zhao, CH
Garnier, S
Pizzi, A
Citation: Ch. Zhao et al., Particleboard dry and wet IB - forecasting by gel time and dry TMA bendingin PF wood adhesives, HOLZ ROH WE, 56(6), 1998, pp. 402-402