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Results:
1-8
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Results: 8
Authors:
Proost, J
Baklanov, M
Maex, K
Delaey, L
Citation: J. Proost et al., Compensation effect during water desorption from siloxane-based spin-on dielectric thin films, J VAC SCI B, 18(1), 2000, pp. 303-306
Authors:
Chizhik, SA
Matvienko, AA
Sidelnikov, AA
Proost, J
Citation: Sa. Chizhik et al., Modeling electromigration-induced stress evolution and drift kinetics witha stress-dependent diffusivity, J APPL PHYS, 88(6), 2000, pp. 3301-3309
Authors:
Proost, J
Hirato, T
Furuhara, T
Maex, K
Celis, JP
Citation: J. Proost et al., Microtexture and electromigration-induced drift in electroplated damasceneCu, J APPL PHYS, 87(6), 2000, pp. 2792-2802
Authors:
Proost, J
Witvrouw, A
Maex, K
D'Haen, J
Cosemans, P
Citation: J. Proost et al., Electromigration-induced drift in damascene and plasma-etched Al(Cu). I. Kinetics of Cu depletion in polycrystalline interconnects, J APPL PHYS, 87(1), 2000, pp. 86-98
Authors:
Proost, J
Maex, K
Delaey, L
Citation: J. Proost et al., Electromigration-induced drift in damascene and plasma-etched Al(Cu). II. Mass transport mechanisms in bamboo interconnects, J APPL PHYS, 87(1), 2000, pp. 99-109
Authors:
Beyer, GP
Maex, K
Daniels, S
Lee, S
Proost, J
Bender, H
Judelewicz, M
Maity, N
Citation: Gp. Beyer et al., Al speed fill, MAT SC S PR, 2(1), 1999, pp. 75-85
Authors:
Witvrouw, A
Proost, J
Roussel, P
Cosemans, P
Maex, K
Citation: A. Witvrouw et al., Stress relaxation in Al-Cu and Al-Si-Cu thin films, J MATER RES, 14(4), 1999, pp. 1246-1254
Authors:
Proost, J
Li, H
Conard, T
Boullart, W
Maex, K
Citation: J. Proost et al., Chemical and electrical characterization of the interaction of BCl3/Cl-2 etching and CF4/H2O stripping plasmas with aluminum surfaces, J ELCHEM SO, 146(11), 1999, pp. 4230-4235
Risultati:
1-8
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