Authors: SABOURET E SCHAFFNIT C JONGSTE JF JANSSEN GCAM RADELAAR S

Citation: E. Sabouret et al., REACTIVE ION ETCHING OF METAL STACK CONSISTING OF AN ALUMINUM-ALLOY, WGEX, BARRIER AND TI ADHESION LAYER, Microelectronic engineering, 37-8(1-4), 1997, pp. 353-363