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Results:
1-2
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Results: 2
TOWARD A BUILDING-IN RELIABILITY APPROACH
Authors:
SCHAFFT HA ERHART DL GLADDEN WK
Citation:
Ha. Schafft et al., TOWARD A BUILDING-IN RELIABILITY APPROACH, Microelectronics and reliability, 37(1), 1997, pp. 3-18
ELECTRICAL CHARACTERIZATION OF INTEGRATED-CIRCUIT METAL LINE THICKNESS
Authors:
MAYO S SCHAFFT HA
Citation:
S. Mayo et Ha. Schafft, ELECTRICAL CHARACTERIZATION OF INTEGRATED-CIRCUIT METAL LINE THICKNESS, Solid-state electronics, 38(12), 1995, pp. 1993-2000
Risultati:
1-2
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