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SENTHINATHAN R
MEHRA A
MAHALINGAM M
DOI Y
ASTRAIN H
Citation: R. Senthinathan et al., ELECTRICAL PACKAGING REQUIREMENTS FOR LOW-VOLTAGE ICS - 3.3 V HIGH-PERFORMANCE CMOS DEVICES AS A CASE-STUDY, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(4), 1994, pp. 493-504
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Authors:
SENTHINATHAN R
NIMMAGADDA S
PRINCE JL
CANGELLARIS AC
Citation: R. Senthinathan et al., MODELING AND SIMULATION OF COUPLED TRANSMISSION-LINE INTERCONNECTS OVER A NOISY REFERENCE PLANE, IEEE transactions on components, hybrids, and manufacturing technology, 16(7), 1993, pp. 705-713
Citation: R. Senthinathan et al., MODULE FREQUENCY ESTIMATION AND NOISE BUDGET LIMITATIONS - TRADE-OFFSIN MULTICHIP MODULES AS A FUNCTION OF CMOS CHIPS INTEGRATION, IEEE transactions on components, hybrids, and manufacturing technology, 16(5), 1993, pp. 478-483