R. Senthinathan et al., MODELING AND SIMULATION OF COUPLED TRANSMISSION-LINE INTERCONNECTS OVER A NOISY REFERENCE PLANE, IEEE transactions on components, hybrids, and manufacturing technology, 16(7), 1993, pp. 705-713
Citations number
10
Categorie Soggetti
Material Science","Engineering, Eletrical & Electronic
A method of modeling and simulation of coupled transmission line inter
connects over a noisy reference plane is presented. Limitations in usi
ng conventional coupled transmission line simulators to model signal p
ropagation over a noisy reference plane are explained. A distributed l
umped element circuit model including reference plane parasitics and a
ssociated coupling (to signal conductors) parasitics is developed, and
verified using SPICE simulations. Inductance and capacitance per-unit
-length [pul] matrix elements are calculated using detailed two-dimens
ional parasitic extractors, and the partial inductance concept. Result
s using this model were compared with conventional ''isolated'' (switc
hing noise isolated) coupled transmission line simulations. Significan
t differences were found. Package pin placement on the reference plane
, and its impact on overall noise characteristics are analyzed.