Authors: CAHILL C COMPAGNO A ODONOVAN J SLATTERY O OMATHUNA SC BARRETT J SERTHELON I VAL C TIGNERES JP STERN J IVEY P MASGRANGEAS M COELLOVERA A

Citation: C. Cahill et al., THERMAL CHARACTERIZATION OF VERTICAL MULTICHIP MODULES MCM-V, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(4), 1995, pp. 765-772