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Results: 1
ENSURING STRUCTURAL TESTABILITY OF HIGH-DENSITY SMT CIRCUIT PACKS
Authors:
ALLEN RW CALAFIORE RL DYER WW FEBO MV SINCLAIR TK
Citation:
Rw. Allen et al., ENSURING STRUCTURAL TESTABILITY OF HIGH-DENSITY SMT CIRCUIT PACKS, AT&T technical journal, 73(2), 1994, pp. 56-65
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