Authors:
SIHLBOM R
DERNEVIK M
LAI ZH
STARSKI JP
LIU JH
Citation: R. Sihlbom et al., CONDUCTIVE ADHESIVES FOR HIGH-FREQUENCY APPLICATIONS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 469-477
Authors:
SIHLBOM R
DERNEVIK M
LINDGREN M
STARSKI JP
LAI ZH
LIU JH
Citation: R. Sihlbom et al., HIGH-FREQUENCY MEASUREMENTS AND SIMULATIONS ON WIRE-BONDED MODULES ONTHE SEQUENTIAL BUILDUP BOARDS (SBUS), IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 478-491