Authors: ZHANG WG WU D SU BZ HAREB SA LEE YC MASTERSON BP

Citation: Wg. Zhang et al., THE EFFECT OF UNDERFILL EPOXY ON WARPAGE IN FLIP-CHIP ASSEMBLIES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 323-329

Authors: CHEN X SU BZ YU L

Citation: X. Chen et al., DRAG FORCE ACTING ON AN EVAPORATING PARTICLE IMMERSED IN A RAREFIED PLASMA-FLOW, Plasma chemistry and plasma processing, 15(1), 1995, pp. 1-23