AAAAAA
Results:
1-8
|
Results: 8
Authors:
RENKEN FP
SUBBARAYAN G
Citation: Fp. Renken et G. Subbarayan, A 2-BODY FORMULATION FOR SOLDER JOINT SHAPE PREDICTION, Journal of electronic packaging, 120(3), 1998, pp. 302-308
Authors:
LI Y
MAHAJAN RL
SUBBARAYAN G
Citation: Y. Li et al., THE EFFECT OF STENCIL PRINTING OPTIMIZATION ON RELIABILITY OF CBGA AND PBGA SOLDER JOINTS, Journal of electronic packaging, 120(1), 1998, pp. 54-60
Authors:
SUBBARAYAN G
RAMAKRISHNA K
SAMMAKIA BG
Citation: G. Subbarayan et al., THE IMPACT OF INTERFACIAL ADHESION AN PTH AND VIA STRESS STATE, Journal of electronic packaging, 119(4), 1997, pp. 260-267
Authors:
DESHPANDE AM
SUBBARAYAN G
MAHAJAN RL
Citation: Am. Deshpande et al., MAXIMIZING SOLDER JOINT RELIABILITY THROUGH OPTIMAL SHAPE DESIGN, Journal of electronic packaging, 119(3), 1997, pp. 149-155
Authors:
SUBBARAYAN G
DESHPANDE A
Citation: G. Subbarayan et A. Deshpande, THE NATURE OF CENTROIDAL LOCUS IN MISALIGNED FLIP-CHIP SOLDER JOINTS, Journal of electronic packaging, 119(3), 1997, pp. 156-162
Authors:
SUBBARAYAN G
FERRILL MG
DEFOSTER SM
Citation: G. Subbarayan et al., RELIABILITY OF METALLIZED CERAMIC PACKAGES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(3), 1996, pp. 685-691
Authors:
SUBBARAYAN G
Citation: G. Subbarayan, A PROCEDURE FOR AUTOMATED SHAPE AND LIFE PREDICTION IN FLIP-CHIP AND BGA SOLDER JOINTS, Journal of electronic packaging, 118(3), 1996, pp. 127-133
Authors:
SUBBARAYAN G
LI Y
MAHAJAN RL
Citation: G. Subbarayan et al., RELIABILITY SIMULATIONS FOR SOLDER JOINTS USING STOCHASTIC FINITE-ELEMENT AND ARTIFICIAL NEURAL-NETWORK MODELS, Journal of electronic packaging, 118(3), 1996, pp. 148-156
Risultati:
1-8
|