Authors:
Salome, P
Richier, C
Essaifi, S
Leroux, C
Zaza, I
Juge, A
Mortini, P
Citation: P. Salome et al., Extended SPICE-like model accounting for layout effects on snapback phenomenon during ESD events., MICROEL REL, 39(6-7), 1999, pp. 833-838
Citation: P. Salome et al., Investigations on the thermal behavior of interconnects under ESD transients using a simplified thermal RC network, MICROEL REL, 39(11), 1999, pp. 1579-1591
Authors:
Salome, P
Leroux, C
Mariolle, D
Lafond, D
Chante, JP
Crevel, P
Reimbold, G
Citation: P. Salome et al., An attempt to explain thermally induced soft failures during low level ESDstresses: study of the differences between soft and hard NMOS failures, MICROEL REL, 38(11), 1998, pp. 1763-1772