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Results:
1-9
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Results: 9
Authors:
Himcinschi, C
Friedrich, M
Murray, C
Streiter, I
Schulz, SE
Gessner, T
Zahn, DRT
Citation: C. Himcinschi et al., Characterization of silica xerogel films by variable-angle spectroscopic ellipsometry and infrared spectroscopy, SEMIC SCI T, 16(9), 2001, pp. 806-811
Authors:
Schulz, SE
Koerner, H
Murray, C
Streiter, I
Gessner, T
Citation: Se. Schulz et al., Influence of barrier and cap layer deposition on the properties of capped and non-capped porous silicon oxide, MICROEL ENG, 55(1-4), 2001, pp. 45-52
Authors:
Riedel, S
Schulz, SE
Baumann, J
Rennau, M
Gessner, T
Citation: S. Riedel et al., Influence of different treatment techniques on the barrier properties of MOCVD TiN against copper diffusion, MICROEL ENG, 55(1-4), 2001, pp. 213-218
Authors:
Flannery, CM
Murray, C
Streiter, I
Schulz, SE
Citation: Cm. Flannery et al., Characterization of thin-film aerogel porosity and stiffness with laser-generated surface acoustic waves, THIN SOL FI, 388(1-2), 2001, pp. 1-4
Authors:
Schulz, SE
Evans, JP
Citation: Se. Schulz et Jp. Evans, Mesoscopic structure of the Punchbowl Fault, Southern California and the geologic and geophysical structure of active strike-slip faults, J STRUC GEO, 22(7), 2000, pp. 913-930
Authors:
Uhlig, M
Bertz, A
Rennau, M
Schulz, SE
Werner, T
Gessner, T
Citation: M. Uhlig et al., Electrical and adhesion properties of plasma-polymerised ultra-low k dielectric films with high thermal stability, MICROEL ENG, 50(1-4), 2000, pp. 7-14
Authors:
Weiss, K
Riedel, S
Schulz, SE
Schwerd, M
Helneder, H
Wendt, H
Gessner, T
Citation: K. Weiss et al., Development of different copper seed layers with respect to the copper electroplating process, MICROEL ENG, 50(1-4), 2000, pp. 433-440
Authors:
Riedel, S
Schulz, SE
Gessner, T
Citation: S. Riedel et al., Investigation of the plasma treatment in a multistep TiN MOCVD process, MICROEL ENG, 50(1-4), 2000, pp. 533-540
Authors:
Hayes, JG
Egan, MG
Murphy, JMD
Schulz, SE
Hall, JT
Citation: Jg. Hayes et al., Wide-load-range resonant converter supplying the SAE J-1773 electric vehicle inductive charging interface, IEEE IND AP, 35(4), 1999, pp. 884-895
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1-9
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