Citation: G. Narasimhan et C. Steinbruchel, Analysis of Langmuir probe data: Analytical parametrization, and the importance of the end effect, J VAC SCI A, 19(1), 2001, pp. 376-378
Citation: H. Kizil et al., TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology, J ELEC MAT, 30(4), 2001, pp. 345-348
Citation: A. Karamcheti et C. Steinbruchel, Parametrization of Laframboise's results for spherical and cylindrical Langmuir probes, J VAC SCI A, 17(5), 1999, pp. 3051-3056
Citation: Se. Kim et C. Steinbruchel, The interaction of metals and barrier layers with fluorinated silicon oxides, SOL ST ELEC, 43(6), 1999, pp. 1019-1023
Citation: Se. Kim et C. Steinbruchel, Metal/fluorinated-dielectric interactions in microelectronic interconnections: Rapid diffusion of fluorine through aluminum, APPL PHYS L, 75(13), 1999, pp. 1902-1904