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Authors: TIENSUU AL BEXELL M SCHWEITZ JA SMITH L JOHANSSON S
Citation: Al. Tiensuu et al., ASSEMBLING 3-DIMENSIONAL MICROSTRUCTURES USING GOLD SILICON EUTECTIC BONDING, Sensors and actuators. A, Physical, 45(3), 1994, pp. 227-236

Authors: BEXELL M TIENSUU AL SCHWEITZ JA SODERKVIST J JOHANSSON S
Citation: M. Bexell et al., CHARACTERIZATION OF AN INCHWORM PROTOTYPE MOTOR, Sensors and actuators. A, Physical, 43(1-3), 1994, pp. 322-329

Authors: LJUNGBERG K SODERBARG A TIENSUU AL JOHANSSON S THUNGSTROM G PETERSSON CS
Citation: K. Ljungberg et al., BURIED COBALT SILICIDE LAYERS IN SILICON CREATED BY WAFER BONDING, Journal of the Electrochemical Society, 141(10), 1994, pp. 2829-2833
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