Authors:
TIENSUU AL
BEXELL M
SCHWEITZ JA
SMITH L
JOHANSSON S
Citation: Al. Tiensuu et al., ASSEMBLING 3-DIMENSIONAL MICROSTRUCTURES USING GOLD SILICON EUTECTIC BONDING, Sensors and actuators. A, Physical, 45(3), 1994, pp. 227-236
Authors:
LJUNGBERG K
SODERBARG A
TIENSUU AL
JOHANSSON S
THUNGSTROM G
PETERSSON CS
Citation: K. Ljungberg et al., BURIED COBALT SILICIDE LAYERS IN SILICON CREATED BY WAFER BONDING, Journal of the Electrochemical Society, 141(10), 1994, pp. 2829-2833