Citation: T. Trenkler et al., 2-DIMENSIONAL PROFILING IN SILICON USING CONVENTIONAL AND ELECTROCHEMICAL SELECTIVE ETCHING, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(1), 1998, pp. 349-354
Authors:
TRENKLER T
DEWOLF P
VANDERVORST W
HELLEMANS L
Citation: T. Trenkler et al., NANOPOTENTIOMETRY - LOCAL POTENTIAL MEASUREMENTS IN COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR TRANSISTORS USING ATOMIC-FORCE MICROSCOPY, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(1), 1998, pp. 367-372
Authors:
CLARYSSE T
CAYMAX M
DEWOLF P
TRENKLER T
VANDERVORST W
MCMURRAY JS
KIM J
WILLIAMS CC
CLARK JG
NEUBAUER G
Citation: T. Clarysse et al., EPITAXIAL STAIRCASE STRUCTURE FOR THE CALIBRATION OF ELECTRICAL CHARACTERIZATION TECHNIQUES, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(1), 1998, pp. 394-400
Citation: T. Trenkler et Jb. Jeanneret, THE PRINCIPLES OF 2-STAGE BETATRON AND MOMENTUM COLLIMATION IN CIRCULAR ACCELERATORS, Particle accelerators, 50(4), 1995, pp. 287-311
Authors:
LI L
BENDER H
TRENKLER T
MERTENS PW
MEURIS M
VANDERVORST W
HEYNS MM
Citation: L. Li et al., SURFACE PASSIVATION AND MICROROUGHNESS OF (100)SILICON ETCHED IN AQUEOUS HYDROGEN HALIDE (HF, HCL, HBR, HI) SOLUTIONS, Journal of applied physics, 77(3), 1995, pp. 1323-1325