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Authors: TUMMALA RR

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Authors: TUMMALA RR

Citation: Rr. Tummala, CONTRIBUTIONS FROM THE 44TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part A, 17(4), 1994, pp. 526-526

Authors: TUMMALA RR HALEY MR CZORNYJ G

Citation: Rr. Tummala et al., MATERIALS IN MICROELECTRONICS, Ceramics international, 19(3), 1993, pp. 191-210