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Results:
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Results: 2
DIFFUSION OF COPPER THROUGH DIELECTRIC FILMS UNDER BIAS TEMPERATURE STRESS
Authors:
RAGHAVAN G CHIANG C ANDERS PB TZENG SM VILLASOL R BAI G BOHR M FRASER DB
Citation:
G. Raghavan et al., DIFFUSION OF COPPER THROUGH DIELECTRIC FILMS UNDER BIAS TEMPERATURE STRESS, Thin solid films, 262(1-2), 1995, pp. 168-176
CHEMICAL-MECHANICAL POLISHING - PROCESS MANUFACTURABILITY
Authors:
JAIRATH R FARKAS J HUANG CK STELL M TZENG SM
Citation:
R. Jairath et al., CHEMICAL-MECHANICAL POLISHING - PROCESS MANUFACTURABILITY, Solid state technology, 37(7), 1994, pp. 71
Risultati:
1-2
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