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Results:
1-4
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Results: 4
Wafer-level chip size package (WL-CSP)
Authors:
Topper, M Fehlberg, S Scherpinski, K Karduck, C Glaw, V Heinricht, K Coskina, P Ehrmann, O Reichl, H
Citation:
M. Topper et al., Wafer-level chip size package (WL-CSP), IEEE T AD P, 23(2), 2000, pp. 233-238
Reliability of flip chip and chip size packages
Authors:
Reichl, H Schubert, A Topper, M
Citation:
H. Reichl et al., Reliability of flip chip and chip size packages, MICROEL REL, 40(8-10), 2000, pp. 1243-1254
First MCM-D modules for the b-physics layer of the ATLAS pixel detector
Authors:
Basken, O Becks, KH Ehrmann, O Gerlach, P Grah, C Gregor, IM Linder, C Meuser, S Richardson, J Topper, M Wolf, J
Citation:
O. Basken et al., First MCM-D modules for the b-physics layer of the ATLAS pixel detector, IEEE NUCL S, 47(3), 2000, pp. 745-749
A MCM-D-type module for the ATLAS pixel detector
Authors:
Becks, KH Beyne, E Ehrmann, O Gerlach, P Gregor, IM Pieters, P Topper, M Truzzi, C Wolf, J
Citation:
Kh. Becks et al., A MCM-D-type module for the ATLAS pixel detector, IEEE NUCL S, 46(6), 1999, pp. 1861-1864
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