Authors: Uschitsky, M Suhir, E Kammlott, GW

Citation: M. Uschitsky et al., Thermoelastic behavior of filled molding compounds Composite mechanics approach, J ELEC PACK, 123(3), 2001, pp. 260-267

Authors: Uschitsky, M Suhir, E

Citation: M. Uschitsky et E. Suhir, Moisture diffusion in epoxy molding compounds filled with particles, J ELEC PACK, 123(1), 2001, pp. 47-51