Authors:
VANDEVELDE B
CHRISTIAENS F
BEYNE E
ROGGEN J
PEETERS J
ALLAERT K
VANDEPITTE D
BERGMANS J
Citation: B. Vandevelde et al., THERMOMECHANICAL MODELS FOR LEADLESS SOLDER INTERCONNECTIONS IN FLIP-CHIP ASSEMBLIES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 177-185
Citation: K. Delanghe et al., THE USE OF WAVE-ABSORBING ELEMENTS FOR THE EVALUATION OF TRANSMISSIONCHARACTERISTICS OF BEAM JUNCTIONS, Journal of vibration and acoustics, 119(3), 1997, pp. 293-303
Citation: K. Delanghe et al., A COMBINED DYNAMIC-STATIC FINITE-ELEMENT MODEL FOR THE CALCULATION OFDYNAMIC STRESSES AT CRITICAL LOCATIONS, Computers & structures, 65(2), 1997, pp. 241-254