Authors:
VANDEVELDE B
CHRISTIAENS F
BEYNE E
ROGGEN J
PEETERS J
ALLAERT K
VANDEPITTE D
BERGMANS J
Citation: B. Vandevelde et al., THERMOMECHANICAL MODELS FOR LEADLESS SOLDER INTERCONNECTIONS IN FLIP-CHIP ASSEMBLIES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 177-185
Authors:
CHRISTIAENS F
VANDEVELDE B
BEYNE E
ROGGEN J
Citation: F. Christiaens et al., EVALUATION OF STRUCTURAL DEGRADATION IN PACKAGED SEMICONDUCTOR COMPONENTS USING A TRANSIENT THERMAL CHARACTERIZATION TECHNIQUE, Microelectronics and reliability, 36(11-12), 1996, pp. 1807-1810