Login
|
New Account
AAAAAA
ITA
ENG
Results:
1-1
|
Results: 1
BALL GRID ARRAY THERMOMECHANICAL RESPONSE DURING REFLOW ASSEMBLY
Authors:
VOTH TE BERGMAN TL
Citation:
Te. Voth et Tl. Bergman, BALL GRID ARRAY THERMOMECHANICAL RESPONSE DURING REFLOW ASSEMBLY, Journal of electronic packaging, 118(4), 1996, pp. 214-222
Risultati:
1-1
|