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Results: 1-8 |
Results: 8
Chemical and structural analysis of etching residue layers in semiconductor devices with energy filtering transmission electron microscopy
Authors: Hens, S Van Landuyt, J Bender, H Boullart, W Vanhaelemeersch, S
Citation: S. Hens et al., Chemical and structural analysis of etching residue layers in semiconductor devices with energy filtering transmission electron microscopy, MAT SC S PR, 4(1-3), 2001, pp. 109-111
Controllable change of porosity of 3-methylsilane low-k dielectric film
Authors: Shamiryan, DG Baklanov, MR Vanhaelemeersch, S Maex, K
Citation: Dg. Shamiryan et al., Controllable change of porosity of 3-methylsilane low-k dielectric film, EL SOLID ST, 4(1), 2001, pp. F3-F5
Characterization of Cu surface cleaning by hydrogen plasma
Authors: Baklanov, MR Shamiryan, DG Tokei, Z Beyer, GP Conard, T Vanhaelemeersch, S Maex, K
Citation: Mr. Baklanov et al., Characterization of Cu surface cleaning by hydrogen plasma, J VAC SCI B, 19(4), 2001, pp. 1201-1211
Integration of Cu and low-k dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures
Authors: Donaton, RA Coenegrachts, B Maenhoudt, M Pollentier, I Struyf, H Vanhaelemeersch, S Vos, I Meuris, M Fyen, W Beyer, G Tokei, Z Stucchi, M Vervoort, I De Roest, D Maex, K
Citation: Ra. Donaton et al., Integration of Cu and low-k dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures, MICROEL ENG, 55(1-4), 2001, pp. 277-283
Low temperature oxidation and selective etching of chemical vapor deposition a-SiC : H films
Authors: Baklanov, MR Van Hove, M Mannaert, G Vanhaelemeersch, S Bender, H Conard, T Maex, K
Citation: Mr. Baklanov et al., Low temperature oxidation and selective etching of chemical vapor deposition a-SiC : H films, J VAC SCI B, 18(3), 2000, pp. 1281-1287
Process integration induced thermodesorption from SiO2/SiLK resin dielectric based interconnects
Authors: Baklanov, MR Muroyama, M Judelewicz, M Kondoh, E Li, H Waeterloos, J Vanhaelemeersch, S Maex, K
Citation: Mr. Baklanov et al., Process integration induced thermodesorption from SiO2/SiLK resin dielectric based interconnects, J VAC SCI B, 17(5), 1999, pp. 2136-2146
Surface characterization of a low dielectric constant polymer-SiLK polymer, and investigation of its interface with Cu
Authors: Rajagopal, A Gregoire, C Lemaire, JJ Pireaux, JJ Baklanov, MR Vanhaelemeersch, S Maex, K Waeterloos, JJ
Citation: A. Rajagopal et al., Surface characterization of a low dielectric constant polymer-SiLK polymer, and investigation of its interface with Cu, J VAC SCI B, 17(5), 1999, pp. 2336-2340
Effects of oxygen and fluorine on the dry etch characteristics of organic low-kappa dielectrics
Authors: Baklanov, MR Vanhaelemeersch, S Bender, H Maex, K
Citation: Mr. Baklanov et al., Effects of oxygen and fluorine on the dry etch characteristics of organic low-kappa dielectrics, J VAC SCI B, 17(2), 1999, pp. 372-379
Risultati: 1-8 |