Authors:
Varadarajan, D
Lee, CY
Krishnamoorthy, A
Duquette, DJ
Gill, WN
Citation: D. Varadarajan et al., A tertiary current distribution model for the pulse plating of copper intohigh aspect ratio sub-0.25 mu m trenches, J ELCHEM SO, 147(9), 2000, pp. 3382-3392