Authors:
Bond, SW
Vendier, O
Lee, M
Jung, S
Vrazel, M
Lopez-Lagunas, A
Chai, S
Dagnall, G
Brooke, M
Jokerst, NM
Wills, DS
Brown, A
Citation: Sw. Bond et al., A three-layer 3-D silicon system using through-Si vertical optical interconnections and SiCMOS hybrid building blocks, IEEE S T QU, 5(2), 1999, pp. 276-286