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Results: 1-5 |
Results: 5

Authors: WEICHEL S DEREUS R LINDAHL M
Citation: S. Weichel et al., SILICON-TO-SILICON WAFER BONDING USING EVAPORATED GLASS, Sensors and actuators. A, Physical, 70(1-2), 1998, pp. 179-184

Authors: WEICHEL S MOLLER PJ
Citation: S. Weichel et Pj. Moller, ANNEALING-INDUCED MICROFACETING OF THE COO(100) SURFACE INVESTIGATED BY LEED AND STM, Surface science, 399(2-3), 1998, pp. 219-224

Authors: DEREUS R CHRISTENSEN C WEICHEL S BOUWSTRA S JANTING J ERIKSEN GF DYRBYE K BROWN TR KROG JP JENSEN OS GRAVESEN P
Citation: R. Dereus et al., RELIABILITY OF INDUSTRIAL PACKAGING FOR MICROSYSTEMS, Microelectronics and reliability, 38(6-8), 1998, pp. 1251-1260

Authors: WINCOTT PL IRWIN JSG JONES G HARDMAN PJ THORNTON G WEICHEL S MOLLER PJ DHANAK VR
Citation: Pl. Wincott et al., ANGLE-RESOLVED PHOTOEMISSION-STUDIES OF THE (GAMMA)OVER-BAR SHOCKLEY SURFACE-STATE ON ORDERED CU(111) OVERLAYERS ON TIO2(110), Surface science, 377(1-3), 1997, pp. 242-246

Authors: NERLOV J CHRISTENSEN SV WEICHEL S PEDERSEN EH MOLLER PJ
Citation: J. Nerlov et al., A PHOTOEMISSION-STUDY OF THE COADSORPTION OF CO2 AND NA ON TIO2(110)-(1X1) AND TIO2(110)-(1X2) SURFACES - ADSORPTION GEOMETRY AND REACTIVITY, Surface science, 371(2-3), 1997, pp. 321-336
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