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Citation: Cn. Oguibe et al., CONDUCTION MECHANISMS IN ANISOTROPIC CONDUCTING ADHESIVE ASSEMBLY, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 235-242

Authors: MANNAN SH WILLIAMS DJ WHALLEY DC

Citation: Sh. Mannan et al., SOME OPTIMUM PROCESSING PROPERTIES FOR ANISOTROPIC CONDUCTIVE ADHESIVES FOR FLIP-CHIP INTERCONNECTION, Journal of materials science. Materials in electronics, 8(4), 1997, pp. 223-231

Authors: WHALLEY DC CONWAY PP

Citation: Dc. Whalley et Pp. Conway, SIMULATION AND INTERPRETATION OF WETTING BALANCE TESTS USING THE SURFACE EVOLVER, Journal of electronic packaging, 118(3), 1996, pp. 134-141

Authors: WHALLEY DC

Citation: Dc. Whalley, A MODEL TO EXPLAIN SMT OPEN-CIRCUIT JOINTS ASSOCIATED WITH ADJACENT SOLDER BRIDGES, JOURNAL OF ELECTRONICS MANUFACTURING, 6(1), 1996, pp. 39-44

Authors: OGUNJIMI AO MANNAN SH WHALLEY DC WILLIAMS DJ

Citation: Ao. Ogunjimi et al., THE ASSEMBLY PROCESS FOR ANISOTROPIC CONDUCTIVE JOINTS - SOME NEW EXPERIMENTAL AND THEORETICAL RESULTS, JOURNAL OF ELECTRONICS MANUFACTURING, 5(4), 1995, pp. 263-271

Authors: WILLIAMS DJ CONWAY PP WHALLEY DC

Citation: Dj. Williams et al., MAKING CIRCUITS MORE THAN ONCE - THE MANUFACTURING CHALLENGES OF ELECTRONICS INTENSIVE PRODUCTS, Proceedings of the Institution of Mechanical Engineers. Part B, Journal of engineering manufacture, 207(2), 1993, pp. 83-90