Authors: Wolf, R Wandel, K Gruska, B

Citation: R. Wolf et al., Low-temperature ICPECVD of silicon nitride in SiH4-NH3-Ar discharges analyzed by spectroscopic ellipsometry and etch behavior in KOH and BHF, SURF COAT, 142, 2001, pp. 786-791

Authors: Dehoff, A Reetz, M Wandel, K Wolf, R

Citation: A. Dehoff et al., Plasma process technology for micromechanic measuring structures, TEC MES, 68(2), 2001, pp. 57-60

Authors: Otto, T Wolf, H Streiter, R Dehoff, A Wandel, K Gessner, T

Citation: T. Otto et al., Process and equipment simulation of dry silicon etching in the absence of ion bombardment, MICROEL ENG, 45(4), 1999, pp. 377-391