AAAAAA

   
Results: 1-10 |
Results: 10
AES analysis of failures in Cu based electromigration test samples
Authors: Baunack, S Kotter, TG Wendrock, H Wetzig, K
Citation: S. Baunack et al., AES analysis of failures in Cu based electromigration test samples, APPL SURF S, 179(1-4), 2001, pp. 245-250
The determination of small areas of retained austenite in TRIP-Steels using high resolution electron back scattering diffraction
Authors: Wendrock, H Richter, J Guth, A
Citation: H. Wendrock et al., The determination of small areas of retained austenite in TRIP-Steels using high resolution electron back scattering diffraction, PRAKT METAL, 38(6), 2001, pp. 314
Study of electromigration damage in Al interconnect lines inside a SEM
Authors: Buerke, A Wendrock, H Wetzig, K
Citation: A. Buerke et al., Study of electromigration damage in Al interconnect lines inside a SEM, CRYST RES T, 35(6-7), 2000, pp. 721-730
The characterisation of irregular austenitic grain growth in micro-alloyedforging steels by linear analysis
Authors: Richter, J Wendrock, H
Citation: J. Richter et H. Wendrock, The characterisation of irregular austenitic grain growth in micro-alloyedforging steels by linear analysis, PRAKT METAL, 37(11), 2000, pp. 589-598
Phase equilibria in the ternary system Fe-Gd-Mo at 600 degrees C
Authors: Zinkevitch, M Mattern, N Wendrock, H Wetzig, K
Citation: M. Zinkevitch et al., Phase equilibria in the ternary system Fe-Gd-Mo at 600 degrees C, MIKROCH ACT, 133(1-4), 2000, pp. 243-251
Relationship between microstructure and electromigration damage in unpassivated PVD copper damascene interconnects
Authors: Koetter, TG Wendrock, H Schuehrer, H Wenzel, C Wetzig, K
Citation: Tg. Koetter et al., Relationship between microstructure and electromigration damage in unpassivated PVD copper damascene interconnects, MICROEL REL, 40(8-10), 2000, pp. 1295-1299
Room temperature grain growth in electroplated copper thin films
Authors: Wendrock, H Bruckner, W Hecker, M Koetter, TG Schloerb, H
Citation: H. Wendrock et al., Room temperature grain growth in electroplated copper thin films, MICROEL REL, 40(8-10), 2000, pp. 1301-1304
Wear resistant coatings on titanium
Authors: Techel, A Richter, A Nowotny, S Beyer, E Wendrock, H
Citation: A. Techel et al., Wear resistant coatings on titanium, METALL, 54(3), 2000, pp. 110-113
Solidification behaviour of Fe-Gd-Mo alloys
Authors: Zinkevitch, M Mattern, N Wendrock, H Behr, G Wetzig, K
Citation: M. Zinkevitch et al., Solidification behaviour of Fe-Gd-Mo alloys, J ALLOY COM, 283(1-2), 1999, pp. 265-281
Stereological analysis and modelling of gradient structures
Authors: Hahn, U Micheletti, A Pohlink, R Stoyan, D Wendrock, H
Citation: U. Hahn et al., Stereological analysis and modelling of gradient structures, J MICROSC O, 195, 1999, pp. 113-124
Risultati: 1-10 |