Authors: Westman, AK Wei, LY

Citation: Ak. Westman et Ly. Wei, TEM study of the interface between HIPed silicon nitride and encapsulationborosilicate glass, J MATER SCI, 35(11), 2000, pp. 2847-2854

Authors: Westman, AK Wei, LY Barre, F

Citation: Ak. Westman et al., Preparation for TEM of layered samples with fragile microstructure and weak layer interface, MICROSC RES, 45(3), 1999, pp. 198-202

Authors: Westman, AK Larker, HT

Citation: Ak. Westman et Ht. Larker, Interaction of encapsulation glass and silicon nitride ceramic during HIPing, J EUR CERAM, 19(16), 1999, pp. 2739-2746